By Yoshihiko Imanaka
The basically ebook to pay attention completely on low temperature cofired ceramics, an enticing know-how for digital parts and substrates which are compact, gentle, and provide high-speed and performance for transportable digital units.
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Extra resources for Multilayered low temperature cofired ceramics (LTCC) technology
This book recognizes that the materials and processes of LTCC technology are interrelated as suggested above. It describes separately the general technical information of each material (ceramic, conductor, and resistor materials) and each process, and it offers commentaries on unique examples resulting from these interrelations. In addition, it includes basic, textbook level content on materials. Introduction 15 16 Multilayered LTCC Technology References  “Development of Ubiquitous Service using Wireless Technology”, NTT Technical Journal, No.
Katz, “Adaptation and mobility in wireless information systems,” IEEE Personal Comm. Quarter, (1994), pp. 6-17.  K. Oida, “Action for Development of Frequency Resources,” The Journal of the institute of Electronics, Information, and Communication Engineers, Vol. 71, No. 5, (1988), pp. 457463.  “Restructuring System on a Chip Strategy with Package Technology as the New Innovation,” NIKKEI MICRODEVICES, No. 189 March (2001), pp. 113-132.  “Activity Around Technology to Embed Devices Internally in PCB’s Suddenly Increases,” NIKKEI ELECTRONICS, No.
9] B. Schwartz, “Microelectronics Packaging: II,” Am. Ceram. Soc. , Vol. 63, No. 4, (1984) pp. 577-81.  A. J. Blodgett, and D. R. Barbour, “Thermal conduction module: A high performance multilayer ceramic package,” IBM J. Res. , Vol. 3 , May (1982), pp. 30.  C. W. A. Chance, C. H. Bajorek, and R. E. Acosta, “The Thin-Film Module and High Performance Semiconductor Package”, IBM J. Res. , Vol. 3 , May (1982), pp 286-296.  “Low-Temperature Fireable Multi-layer Ceramic Circuit Board”, NIKKEI NEW MATERIALS, Aug.
Multilayered low temperature cofired ceramics (LTCC) technology by Yoshihiko Imanaka